M3-87U1
3.5" Fanless SBC with Intel® 5th Gen. Broadwell ULT Platform for High-performance Solution Compact Board

‧Intel® Broadwell ULT-Series Processors
‧Support DDR3L 1600 MHz SO-DIMM memory up to 8GB
‧Support HDMI / VGA and LVDS displays
‧Dual GbE LAN, Dual USB 3.0, and 4 COM
‧Dual Mini-PCIe and Dual SATA 3.0 and mSATA

/ Introduction
/ Specifications
SYSTEM
CPU Intel® Broadwell U-Series Core i7/i5/i3 Mobile Processors
CPU TYPE BGA
BIOS AMI 128Mbit SPI
MEMORY SO-DIMM DDR3L 1600MHz (non-ECC)
MAX. MEMORY CAPACITY Up to 8GB
SOCKET 204-pin SO-DIMMs×1
DISPLAY
CONTROLLER Intel® HD Graphics
LVDS Dual Channel 24-bits, up to 1920×1200
DISPLAY INTERFACE HDMI, up to 1920×1200
VGA, up to 1920×1200
I/O
STORAGE SATA 3.0×2
mSATA×1
ETHERNET Intel® I218-LM GbE LAN PHY×1
Intel® I210-AT GbE LAN×1
AUDIO Realtek® ALC887 HD (Co-layout Realtek® ALC888S HD)
AUDIO AMPLIFIER CHIPSET TI TPA2008D2PWPR
SUPER I/O Fintek F81866AD-I
H/W MONITOR 255-level Watchdog Timer
SMART FAN Yes
USB PORT USB 2.0×4 (rear×2, internal×2)
USB 3.0×2 (rear×2)
SERIAL PORT COM Ports (internal)×4
COM1: RS-232/422/485, 0V/5V/12V
COM2~4: RS-232, 0V/5V/12V
PS/2 1 (wafer connector)
GPIO 8-bits (4×GPI; 4×GPO)
EXPANSION SLOT Mini-PCIe×2 (One with SIM holder)
POWER SUPPLY
DC input/output DC-in 12V/19V/24V
MACHANICAL
DIMENSIONS 146×102 mm (3.5")
WEIGHT 0.35 kg
ENVIRONMENTAL
OPERATING TEMPERATURE 0°C~60°C
OPERATING HUMIDITY 10% ~ 90%, non-condensing
STORAGE TEMPERATURE -20° C ~ 80° C
STORAGE HUMIDITY 10% ~ 90%, non-condensing
CERTIFICATION
EMC FCC, CE, C-Tick, VCCI, BSMI
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