EN JP TW
Products
MC-77QM1
COM Express Type 6 Compact Solution with Intel® i7/i3 Embedded Mobile Processor MC-77QM1
‧Intel® Embedded Mobile i7/i3/Celeron processor
‧DDR3 1600MHz SO-DIMM up to 8GB
‧Support 3 DDI ports for VGA ,LVDS, and HDMI
‧One Intel® GbE LAN w/ iAMT 8.0 supported
‧2 x SATA 3.0; 2×SATA 2.0
‧2×COM; 4×USB 3.0; 8×USB 2.0
/ Introduction

COM Express Type 6 Compact Solution with Intel® i7/i3 Embedded Mobile Processor MC-77QM1

/ Specifications
SYSTEM
CPU 3rd Gen Intel® Mobile Core™ i7-3517UE/i3- 3217UE/1020E Celeron Processor
CPU FREQUENCY 2.8 GHz
1.6 GHz
2.2 GHz
L2 CACHE 4MB
3MB
2MB
CPU TYPE BGA
CHIPSET Intel® QM77 Express
BIOS AMI
MEMORY Single-channel DDR3 1600MHz
MAX. MEMORY CAPACITY Up to 8GB
SOCKET 204-pin SO-DIMM×1
DISPLAY
CONTROLLER Intel® HD Graphics
GRAPHIC MEMORY Shared system memory up to 1.7 GB SDRAM
LVDS Dual-channel 24-bit
MULTIPLE DISPLAY 2 independent displays
3 independent displays
DISPLAY INTERFACE VGA×1, up to 2048×1536
LVDS up to 1920×1200 @ 60 Hz
DDI (HDMI/DVI/DP)×3, HDMI/DVI up to 1920×1200 @ 60 Hz; DP up to 2560×1600 @ 60 Hz
I/O
STORAGE SATA 3.0×2
SATA 2.0×2
ETHERNET Intel® 82579LM GbE-PHY LAN (AMT 8.0 support- ed)
AUDIO Support HD audio interface to carrier board
H/W MONITOR 256-level Watchdog Timer
SMART FAN Yes
USB PORT USB 2.0×8 (to carrier board)
USB 3.0×4 (to carrier board)
SERIAL PORT COM×2 (to carrier board)
EXPANSION SLOT PCIe x16×1
PCIe x1×7
TPM Pin header
POWER SUPPLY
DC input/output N/A
ATX ATX: +12 V and +5 VSB (standby power)
AT: +12 V
MACHANICAL
DIMENSIONS 95×95 mm (COM Express compact module)
WEIGHT 95 g
ENVIRONMENTAL
OPERATING TEMPERATURE 0°C~60°C
OPERATING HUMIDITY 10% ~ 90%, non-condensing
STORAGE TEMPERATURE -20° C ~ 80° C
STORAGE HUMIDITY 10% ~ 90%, non-condensing
CERTIFICATION
EMC FCC, CE, C-Tick, VCCI, BSMI
/ Download